WEEK 10 (FYP 2)

TITTLE : TROUBLESHOOT

Last week I already finish with the design of the PCB board. Now I need to solder the component into the PCB board. Picture Below is the complete circuit that have been solder with the right component. The first picture is the bottom part of the PCB board that the soldering part has been done.

In this circuit, it have 4 connection.First, the connection of power supply, 2nd is connection to pic circuit, 3rd  to the sensor and 4th is connection to MAX232 or GSM. To trouble shoot this circuit, +ve prop of multimeter we connect to the connection of pic and negetive prop to the ground. As I mention above , the Vin is 5 volt to operated this circuit. To know this circuit is function or not, we adjust the variable resistor and we can see the value of multimeter (dc) is changed. It proof that this circuit is function.

Figure 1 :

Figure 2 :

Figure 3 :

Referring the picture above, the power supply is set in 12 volt dc.and we can see at the first picture is nothing happen. to make sure this circuit is working, from the o/p that connect to pic, we 'short' with jumper and we can see LED is 'on'. If the LED is off, might be this circuit have problem.

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sh mohd faiz

                                             

WEEK 9 (FYP 2)

TITTLE : BURN THE PIC16877A OF MY PROJECT

Figure below shows of my complete project after finish installing all component and soldering. For figure it shows the PIC programmer for the process of burner the IC 16877A.

Figure 1 : After complete installation

Figure 2 : PIC Burner

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sh mohd faiz

WEEK 8 (FYP 2)

TITTLE : RESEARCH FOR THE PROGRAM OF MICRO CONTROLLER


For this week, I have not doing nothing much because of  little bit busy of the phase test week. This week I only focus on of the program  and do a little research of my IC (Micro controller). I hope I will get the program of my 3 sensor and finished in week ten so the remaining week I can focus on troubleshooting and my final report.

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sh mohd faiz

                                             

WEEK 7 (FYP 2)

TITTLE : SOLDERING AND ASSEMBLY PROCESS

This show that I am doing a soldering and assembly process for my project Automatic Accident Alert System. Alhamdulillah all the schedule according to my plan and I have much time to do troubleshooting if anything go wrong.

Figure 1 : List of the component for my circuit

Figure 2 : Show the soldering process

Figure 3 : Show the halfway of my project

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sh mohd faiz

WEEK 6 (FYP 2)

TITTLE : ETCHING PROCESS

This week, I continue with etching process. Begin the etching process using a acid liquid to remove copper that is non use for the circuit. After etching process used the sand paper to remove non use copper on the board until only the tracking one is there. The etching process must be completed first before it can install the component on the board using a drill and solder.

Figure 1 : the track on the board after the Iron process

Figure 2 : Etching process using a acid liquid to remove copper

Figure 3: After etching process the acid liquid must be disposed in the right place

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sh mohd faiz